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We have a large inventory from top manufacturers such as Hewlett Packard Co, Agilent Technologies Inc Div Ag, Agilent Technologies Inc with top products such as 08903-80014, 08903-80014, 08903-80014, 1816-0916, 1816-0916 for NSN 5962-01-276-3978 Microcircuit Memory Parts. We pride ourselves on serving the U.S. and her allies while maintaining our No China Sourcing Policy. We invite you to explore our NSN parts at your leisure, and our team of industry experts are on standby to assist you through the purchasing process as needed. Fill out the request for quote form below and hear from a dedicated account representative in fifteen minutes.
Part Information of NSN 5962012763978
Part No | Manufacturer | Item Name | QTY | RFQ |
---|---|---|---|---|
08903-80014 | hewlett packard co | microcircuit memory | Avl | RFQ |
08903-80014 | agilent technologies inc div ag | microcircuit memory | Avl | RFQ |
08903-80014 | agilent technologies inc | microcircuit memory | Avl | RFQ |
1816-0916 | agilent technologies inc | microcircuit memory | Avl | RFQ |
1816-0916 | agilent technologies inc div ag | microcircuit memory | Avl | RFQ |
1816-0916 | hewlett packard co | microcircuit memory | Avl | RFQ |
6331-1J | mmi amd | microcircuit memory | Avl | RFQ |
AM27519PC | advanced micro devices inc | microcircuit memory | Avl | RFQ |
HM1-7603-5 | intersil corporation | microcircuit memory | Avl | RFQ |
Product Details of NSN 5962012763978
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND W/ENABLE AND 3-STATE OUTPUT |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
ADAT | BODY WIDTH | 0.302 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | +0.0/+75.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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